Extec Diamond Lapping Film - Consumables - Materials Preparation

Extec Dia-Lap Diamond Lapping Film (continuous and interrupted) is available for a variety of wet or dry (W/D) applications and with Pressure Sensitive Adhesive (PSA) or plain backing. Special size orders are also available.

Extec ® Dia-lap CONTINUOUS

Premium graded continuous diamond particles are resin bonded to highly uniform polyester film resulting in consistent performance for ultimate flatness and finish. Recommended for carbides, ceramics, fiber optics, wafers, microelectronic devices, in addition to petrographic and high hardness metals where critical surface flatness is required. Available in discs from 0.1 micron to 45 micron.

Extec ® I Dia-lap INTERRUPTED

Recommended for less critical applications requiring more aggressive materials removal. Generally used in production facilities. Available in discs and sheets from 0.5 micron to 9 micron.

To discuss your application, talk to one of our experienced sales engineers. You can also find full catalog details and access online ordering by visiting the Extec website.

Extec ® Dia-lap CONTINUOUS	Unit: Pkg/5 Type: Disc Backing: Misc. Available Micron Size: 0.1µ to 30.0µ Color: Misc. Available Diameter: 8.0” (203.0 mm) to 12.0” (305.0 mm) Thickness (Mil): 3.0
Extec ® I Dia-lap INTERRUPTED	Unit: Pkg/3 Type: Misc. Available Backing: Misc. Available Micron Size: 0.5µ to 9.0µ Color: Misc. Available Length: 6.0” (152.0 mm) Width: 6.0” (152.0 mm) Diameter: 8.0” (203.0 mm) to 12.0” (305.0 mm)