Nikon XT V 160 NF Nanofocus X-ray Inspection - X-ray and CT Systems - Measuring

XT V 160 NF is a high-precision, flat-panel based X-ray inspection system that facilitates real-time imaging and defect analysis of next-generation wafer-level, semiconductor device and PCBA applications. Equipped with an in-house designed X-ray NanoFocus source and high precision manipulator, this industry-leading inspection system offers unrivalled feature recognition compared to any product available on the market today. As such, the XT V 160 NF is indispensable for any electronics development and production environment.

Key Benefits

<0.1 μm feature recognition up to 6 W power
Productivity increase by automation and instant reporting
High precision manipulator with vibration reduction
3 Mpixel flat panel for ultra high definition
Large tray to load multiple components and boards as well as 450 mm wafer ready

The Ultimate NanoFocus X-ray System For Next-generation Wafer, Semiconductor & PCBA Inspection

3D Analysis

The 3D analysis option on the XT V 160 NF is based on laminography reconstruction techniques, providing sub-micron defect recognition. It provides a method of inspecting a region of interest which can be challenging to inspect with 2D radiography, such as 3D stack dies or BGA pad cracks. From the 3D model it is possible to view any plane of a sample from any direction without the need to isolate or cut the interest area.

Applications

The continued demand for high performance electronics is driving packaging technology towards tighter density, higher IO capabilities and most importantly reduced footprint.

Modern X-ray inspection systems must provide the highest magnification, sharpest imaging and uncompromised accuracy.

Through Silicon Via (TSV) filling and voids
Cu-Pillar, micro-bump cold joint detection and void analysis
BGA voids, size measurements, cold joint and head-in-pillow detection
Ultra-fine pitch bond wire analysis: ball bond, broken wire, wire sweep, stitch bond
QFN/QFP inspection including automated pad void array analysis
3D stack die and Pack-on-Package (POP)
MEMS applications with narrow density variations
Complete automated wafer inspection for micro-bump metrology

KV Range	30-160 kV
Max. Beam Current	600 μA
Max. Tube Power	20 W
Min. Feature Recognition	<0.1 μm up to 6W tube power
Geometric Magnification	up to 2,400x
Detector	3Mpixel (1,944 x 1,536 pixels) 75 μm pixel size 26 fps update rate
Max. Inspection Area	510 × 510 mm
Max. Board Size	580 × 580 mm
Max. Tilt Angle	60°
Cabinet Size	W: 1,819 mm (excl. operator console) H: 1,998 mm D: 1,728 mm
Vibration Isolation	Anti-vibration mounts (standard)
Monitor	Single 30” or dual 22” display
X-ray safety	1 μSv/hr (to IRR 99)